| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| NVH820S75L4SPC | IGBT模块 |
ONSEMI/安森美 |
SSDC33 |
2110 |
50000 |
|||
| 6336Y SRKXB | IC |
INTEL/英特尔 |
BGA |
24+ |
600 |
|||
| KHBAC4A03D-MC1H /HBM3 24G | IC |
SAMSUNG/三星 |
BGA |
2340 |
2600 |
|||
| FF1200R12IE5P | 模块 |
INFINEON/英飞凌 |
MODULE |
22+ |
8000 |
|||
| FF600R17ME4 | IGBT模块 |
INFINEON/英飞凌 |
MODULE |
25+ |
10000 |
|||
| KHBBC4B03B-MC1K/HBM3E 9.2 | IC |
SAMSUNG/三星 |
BGA |
25+ |
40000 |
|||
| KHBA84A03C-MC1H/KHBA84A03D-MC1H | 存储IC |
SAMSUNG/三星 |
BGA |
24+ |
30000 |
|||
| H5WRAGESM8W-N8L | 其他IC |
SKHYNIX/海力士 |
BGA |
25+ |
20000 |
|||
| RK3588 | 单片机MCU |
ROCKCHIP/瑞芯微 |
BGA |
2513 |
6000 |
|||
| HI3559ARFCV100 | IC |
HISILICON/海思 |
BGA |
24+ |
4080 |
|||
| MZWLR7T6HALA-00AGG/PM1733 7.68TB | IC |
SAMSUNG/三星 |
F |
22+ |
300 |
|||
| SI47920A2GE1AM | SILICON/芯科 |
QFN |
21+ |
25000 |
||||
| R5F1026AASP#35 | RENESAS/瑞萨 |
LSSOP20 |
21+ |
30000 |
||||
| R5R0C022FA#V0 | RENESAS/瑞萨 |
QFP52 |
21+ |
190000 |
||||
| R7F701442EAFB-C#BA0 | RENESAS/瑞萨 |
MCU |
21+ |
2000 |
||||
| GD32F305ZET6 | GD/兆易创新 |
LQFP144 |
21+ |
30000 |
||||
| KSZ9031MNXIC-TR | IC |
MICROCHIP/微芯 |
QFN64 |
21+ |
9000 |
|||
| ISL8117AFRZ-T |
|
电源IC |
INTERSIL |
QFN16 |
21+ |
60000 |
||
| ALC5651-CG | IC |
REALTEK/瑞昱 |
QFN40 |
21+ |
6900 |
|||
| NUC029TAN | IC |
NUVOTON/新唐 |
QFN33 |
20+ |
5000 |
|||
| TPA3221DDVR | 运放IC |
TI/德州仪器 |
HTSSOP44 |
4000 |
||||
| MSP430F449IPZR | IC |
TI/德州仪器 |
QFP100 |
22 |
2000 |
|||
| HV2701FG-G | IC |
SUPERTEX/超科 |
QFP48 |
2110 |
50000 |
|||
| ADSP-BF608BBCZ-5 | IC |
ADI/亚德诺 |
BGA |
2230 |
420 |
|||
| LTM4618EY#PBF | 电源IC |
ADI/亚德诺 |
BGA-84 |
24+ |
1000 |
|||
| KHAA84901B-JC17 | IC |
SAMSUNG/三星 |
BGA |
24+ |
13000 |
|||
| S3FW9FJM/S3FW9FJMAB | IC |
SAMSUNG/三星 |
QFN |
22+ |
60000 |
|||
| M321R8GA0BB0-CQK/M321R8GA0PB0-CWM | 其他设备 |
SAMSUNG/三星 |
2306 |
16000 |
||||
| MLX81106KDC-CAE-000-RE | 驱动IC |
MELEXIS/迈来芯 |
SOP8 |
21+ |
6000 |
|||
| OPA857IRGTR | IC |
TI/德州仪器 |
QFN16 |
21+ |
60000 |